The use of pressure-sensitive adhesives in industrial applications is steadily increasing. This is because pressure-sensitive adhesives are easy, safe and inexpensive to process. However, they tend to creep at elevated temperatures and are thus only suitable to a limited extent for permanently loaded structural bonds. A solution to this is to be provided by post-crosslinking pressure-sensitive adhesive systems, which are being developed as part of a newly launched project at SKZ.
Pressure-induced curing adhesive tape (Photo: SKZ)
The aim of this project is to develop and test pressure-sensitive post-crosslinking pressure-sensitive adhesive systems based on microcapsules. The challenge is to encapsulate one of the components of two-component adhesives in such a way that it breaks when exposed to low pressure, thus starting the crosslinking process without much effort or the use of machines. At the same time, this must withstand the winding pressure, for example in the production of adhesive tapes. For this purpose, capsule materials adapted to the respective adhesives are tested. SMEs in particular benefit from the results, as the investment outlay for this type of curing without special plant technology is very low.
Within the framework of the research project of the Industrial Cooperative Research (IGF) funding programme, know-how on microencapsulation, formulation and processing as well as on the properties of pressure-sensitive post-curing pressure-sensitive adhesive systems is being developed and made available to the participating companies. This will enable work processes to be designed more effectively and economically in the future. Companies interested in participating in the project's accompanying committee are asked to contact the project manager Andreas Schneider.